Adhesion in Microelectronics

Book Adhesion in Microelectronics Cover

Adhesion in Microelectronics PDF book by K. L. Mittal Read Online or Free Download in ePUB, PDF or Kindle eBooks. Published in 25 August 2014 the book become immediate popular and critical acclaim in Technology & Engineering books. Click Download Book button to get book file. Read some info about this book below.

  • Publisher : John Wiley & Sons
  • Release : 25 August 2014
  • ISBN : 9781118831342
  • Page : 368 pages
  • Total View : 7232 Views
  • Rating : 4.5/5 from 103 voters

Adhesion in Microelectronics Book PDF summary

This comprehensive book will provide both fundamental andapplied aspects of adhesion pertaining to microelectronics in asingle and easily accessible source. Among the topics to be coveredinclude; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials asit pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array ofpertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings

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Adhesion in Microelectronics

Adhesion in Microelectronics
  • Author : K. L. Mittal,Tanweer Ahsan
  • Publisher : John Wiley & Sons
  • Total Download : 103
  • File Size : 43,8 Mb
DOWNLOAD BOOKAdhesion in Microelectronics

Adhesion in Microelectronics PDF book is popular Technology & Engineering book written by K. L. Mittal,Tanweer Ahsan. The book was released by John Wiley & Sons in 25 August 2014 with total hardcover pages 368. This comprehensive book will provide both fundamental andapplied aspects of adhesion pertaining to microelectronics in asingle and easily accessible source. Among the topics to be coveredinclude; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials asit pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array ofpertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of

Adhesion Measurement of Films & Coatings

Adhesion Measurement of Films & Coatings
  • Author : K. L. Mittal
  • Publisher : VSP
  • Total Download : 261
  • File Size : 41,8 Mb
DOWNLOAD BOOKAdhesion Measurement of Films & Coatings

Adhesion Measurement of Films & Coatings PDF book is popular Technology & Engineering book written by K. L. Mittal. The book was released by VSP in 02 October 2022 with total hardcover pages 368. This book documents the proceedings of the Second International Symposium on Adhesion Measurement of Films and Coatings, held in Newark, NJ, October 25-27, 1999. Since the First Symposium (Boston 1992) there had been considerable activity in devising new, more reliable and more efficient ways to measure adhesion of films and coatings, which resulted in the decision to organize the Newark Symposium.Films and coatings are used for a variety of purposes – functional, decorative, protective, etc. – in a host of applications. Irrespective of

Progress in Adhesion and Adhesives

Progress in Adhesion and Adhesives
  • Author : K. L. Mittal
  • Publisher : John Wiley & Sons
  • Total Download : 514
  • File Size : 49,9 Mb
DOWNLOAD BOOKProgress in Adhesion and Adhesives

Progress in Adhesion and Adhesives PDF book is popular Technology & Engineering book written by K. L. Mittal. The book was released by John Wiley & Sons in 15 June 2017 with total hardcover pages 368. With the ever-increasing amount of research being published it is a Herculean task to be fully conversant with the latest research developments in any field, and the arena of adhesion and adhesives is no exception. Thus, topical review articles provide an alternate and very efficient way to stay abreast of the state-of-the-art in may subjects representing the field of adhesion science and adheisves. Based on the success and the warm reception accorded to the premier volume in this series “Progress

Adhesion International 1993

Adhesion International 1993
  • Author : Louis H. Sharpe
  • Publisher : CRC Press
  • Total Download : 728
  • File Size : 41,6 Mb
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Adhesion International 1993 PDF book is popular Technology & Engineering book written by Louis H. Sharpe. The book was released by CRC Press in 06 February 1996 with total hardcover pages 368. First published in 1996. ADHESION INTERNATIONAL 1993 is a volume of the Proceedings of the 16th Annual Meeting of The Adhesion Society, Inc. Williamsburg, Virginia, USA February 21-26,1993. This meeting featured an International Symposium on The Interphase.

Mechanics of Microelectronics

Mechanics of Microelectronics
  • Author : G.Q. Zhang,W.D. van Driel,X.J. Fan
  • Publisher : Springer Science & Business Media
  • Total Download : 363
  • File Size : 48,8 Mb
DOWNLOAD BOOKMechanics of Microelectronics

Mechanics of Microelectronics PDF book is popular Technology & Engineering book written by G.Q. Zhang,W.D. van Driel,X.J. Fan. The book was released by Springer Science & Business Media in 25 August 2006 with total hardcover pages 368. This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

Microelectronics Packaging Handbook

Microelectronics Packaging Handbook
  • Author : R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein
  • Publisher : Springer Science & Business Media
  • Total Download : 682
  • File Size : 42,8 Mb
DOWNLOAD BOOKMicroelectronics Packaging Handbook

Microelectronics Packaging Handbook PDF book is popular Technology & Engineering book written by R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein. The book was released by Springer Science & Business Media in 27 November 2013 with total hardcover pages 368. Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto,

Handbook of Wafer Bonding

Handbook of Wafer Bonding
  • Author : Peter Ramm,James Jian-Qiang Lu,Maaike M. V. Taklo
  • Publisher : John Wiley & Sons
  • Total Download : 440
  • File Size : 42,8 Mb
DOWNLOAD BOOKHandbook of Wafer Bonding

Handbook of Wafer Bonding PDF book is popular Technology & Engineering book written by Peter Ramm,James Jian-Qiang Lu,Maaike M. V. Taklo. The book was released by John Wiley & Sons in 13 February 2012 with total hardcover pages 368. The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/

Dielectric Films for Advanced Microelectronics

Dielectric Films for Advanced Microelectronics
  • Author : Mikhail Baklanov,Karen Maex,Martin Green
  • Publisher : John Wiley & Sons
  • Total Download : 243
  • File Size : 48,7 Mb
DOWNLOAD BOOKDielectric Films for Advanced Microelectronics

Dielectric Films for Advanced Microelectronics PDF book is popular Technology & Engineering book written by Mikhail Baklanov,Karen Maex,Martin Green. The book was released by John Wiley & Sons in 04 April 2007 with total hardcover pages 368. The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made