Modeling Analysis Design and Tests for Electronics Packaging beyond Moore

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  • Publisher : Woodhead Publishing
  • Release : 22 November 2019
  • ISBN : 9780081025338
  • Page : 434 pages
  • Rating : 4.5/5 from 103 voters

Modeling Analysis Design and Tests for Electronics Packaging beyond Moore Book PDF summary

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging

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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
  • Author : Hengyun Zhang,Faxing Che,Tingyu Lin,Wensheng Zhao
  • Publisher : Woodhead Publishing
  • Release Date : 2019-11-22
  • ISBN : 9780081025338
DOWNLOAD BOOKModeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.

Modeling, Analysis, Design and Tests for Electronics Packaging Beyond Moore

Modeling, Analysis, Design and Tests for Electronics Packaging Beyond Moore
  • Author : 张恒运,车法星,林挺宇,赵文生
  • Publisher : Unknown
  • Release Date : 2021
  • ISBN : 7122379523
DOWNLOAD BOOKModeling, Analysis, Design and Tests for Electronics Packaging Beyond Moore

Advances in Robotics, Automation and Data Analytics

Advances in Robotics, Automation and Data Analytics
  • Author : Jessnor Arif Mat Jizat,Ismail Mohd Khairuddin,Mohd Azraai Mohd Razman,Ahmad Fakhri Ab. Nasir,Mohamad Shaiful Abdul Karim,Abdul Aziz Jaafar,Lim Wei Hong,Anwar P. P. Abdul Majeed,Pengcheng Liu,Hyun Myung,Han-Lim Choi,Gian-Antonio Susto
  • Publisher : Springer Nature
  • Release Date : 2021-03-10
  • ISBN : 9783030709174
DOWNLOAD BOOKAdvances in Robotics, Automation and Data Analytics

This book presents essentially a collection of proceedings that deliberate on the key challenges and recent trends on robotics, automation and data analytics which are the pillars of Industry 4.0. Solutions that are employed in the multitude spectra of innovative robotics & automation and data analytics are discussed. The readers are expected to gain an insightful view on the current trends, issues, mitigating factors as well as solutions from the book. This book consists of selected papers presented at the 2nd International

Heat Exchangers

Heat Exchangers
  • Author : Laura Castro Gómez,Víctor Manuel Velázquez Flores,Miriam Navarrete Procopio
  • Publisher : BoD – Books on Demand
  • Release Date : 2022-03-23
  • ISBN : 9781839697913
DOWNLOAD BOOKHeat Exchangers

The demand for energy to satisfy the basic needs and services of the population worldwide is increasing as are the economic costs associated with energy production. As such, it is essential to emphasize energy recovery systems to improve heat transfer in thermal processes. Currently, significant research efforts are being conducted to expose criteria and analysis techniques for the design of heat exchange equipment. This book discusses optimization of heat exchangers, heat transfer in novel working fluids, and the experimental and

Springer Handbook of Experimental Solid Mechanics

Springer Handbook of Experimental Solid Mechanics
  • Author : William N. Sharpe
  • Publisher : Springer Science & Business Media
  • Release Date : 2008-12-04
  • ISBN : 9780387268835
DOWNLOAD BOOKSpringer Handbook of Experimental Solid Mechanics

As a reference book, the Springer Handbook provides a comprehensive exposition of the techniques and tools of experimental mechanics. An informative introduction to each topic is provided, which advises the reader on suitable techniques for practical applications. New topics include biological materials, MEMS and NEMS, nanoindentation, digital photomechanics, photoacoustic characterization, and atomic force microscopy in experimental solid mechanics. Written and compiled by internationally renowned experts in the field, this book is a timely, updated reference for both practitioners and researchers

Arbitrary Modeling of TSVs for 3D Integrated Circuits

Arbitrary Modeling of TSVs for 3D Integrated Circuits
  • Author : Khaled Salah,Yehea Ismail,Alaa El-Rouby
  • Publisher : Springer
  • Release Date : 2014-08-21
  • ISBN : 9783319076119
DOWNLOAD BOOKArbitrary Modeling of TSVs for 3D Integrated Circuits

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as

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  • Author : Claudius Ptolemaeus
  • Publisher : Lee & Seshia
  • Release Date : 2013-09-27
  • ISBN : 9781304421067
DOWNLOAD BOOKSystem Design, Modeling, and Simulation Using Ptolemy II

This book is a definitive introduction to models of computation for the design of complex, heterogeneous systems. It has a particular focus on cyber-physical systems, which integrate computing, networking, and physical dynamics. The book captures more than twenty years of experience in the Ptolemy Project at UC Berkeley, which pioneered many design, modeling, and simulation techniques that are now in widespread use. All of the methods covered in the book are realized in the open source Ptolemy II modeling framework

Op Amps for Everyone

Op Amps for Everyone
  • Author : Ron Mancini
  • Publisher : Newnes
  • Release Date : 2003
  • ISBN : 9780750677011
DOWNLOAD BOOKOp Amps for Everyone

The operational amplifier ("op amp") is the most versatile and widely used type of analog IC, used in audio and voltage amplifiers, signal conditioners, signal converters, oscillators, and analog computing systems. Almost every electronic device uses at least one op amp. This book is Texas Instruments' complete professional-level tutorial and reference to operational amplifier theory and applications. Among the topics covered are basic op amp physics (including reviews of current and voltage division, Thevenin's theorem, and transistor models), idealized op

Routing Congestion in VLSI Circuits

Routing Congestion in VLSI Circuits
  • Author : Prashant Saxena,Rupesh S. Shelar,Sachin Sapatnekar
  • Publisher : Springer Science & Business Media
  • Release Date : 2007-04-27
  • ISBN : 9780387485508
DOWNLOAD BOOKRouting Congestion in VLSI Circuits

This volume provides a complete understanding of the fundamental causes of routing congestion in present-day and next-generation VLSI circuits, offers techniques for estimating and relieving congestion, and provides a critical analysis of the accuracy and effectiveness of these techniques. The book includes metrics and optimization techniques for routing congestion at various stages of the VLSI design flow. The subjects covered include an explanation of why the problem of congestion is important and how it will trend, plus definitions of metrics

VLSI Systems Design

VLSI Systems Design
  • Author : Anonim
  • Publisher : Unknown
  • Release Date : 1986
  • ISBN : UVA:X001195786
DOWNLOAD BOOKVLSI Systems Design

Modeling and Simulation of Systems Using MATLAB and Simulink

Modeling and Simulation of Systems Using MATLAB and Simulink
  • Author : Devendra K. Chaturvedi
  • Publisher : CRC Press
  • Release Date : 2017-12-19
  • ISBN : 9781439806739
DOWNLOAD BOOKModeling and Simulation of Systems Using MATLAB and Simulink

Not only do modeling and simulation help provide a better understanding of how real-world systems function, they also enable us to predict system behavior before a system is actually built and analyze systems accurately under varying operating conditions. Modeling and Simulation of Systems Using MATLAB® and Simulink® provides comprehensive, state-of-the-art coverage of all the important aspects of modeling and simulating both physical and conceptual systems. Various real-life examples show how simulation plays a key role in understanding real-world systems. The

Integrated Circuit Test Engineering

Integrated Circuit Test Engineering
  • Author : Ian A. Grout
  • Publisher : Springer Science & Business Media
  • Release Date : 2005-08-22
  • ISBN : 1846280230
DOWNLOAD BOOKIntegrated Circuit Test Engineering

Using the book and the software provided with it, the reader can build his/her own tester arrangement to investigate key aspects of analog-, digital- and mixed system circuits Plan of attack based on traditional testing, circuit design and circuit manufacture allows the reader to appreciate a testing regime from the point of view of all the participating interests Worked examples based on theoretical bookwork, practical experimentation and simulation exercises teach the reader how to test circuits thoroughly and effectively

Three-dimensional Integrated Circuit Design

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  • Author : Vasilis F. Pavlidis,Eby G. Friedman
  • Publisher : Morgan Kaufmann
  • Release Date : 2010-07-28
  • ISBN : 0080921868
DOWNLOAD BOOKThree-dimensional Integrated Circuit Design

With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects

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  • Author : Sarah B. Boyd
  • Publisher : Springer Science & Business Media
  • Release Date : 2011-10-12
  • ISBN : 1441999884
DOWNLOAD BOOKLife-Cycle Assessment of Semiconductors

Life-Cycle Assessment of Semiconductors presents the first and thus far only available transparent and complete life cycle assessment of semiconductor devices. A lack of reliable semiconductor LCA data has been a major challenge to evaluation of the potential environmental benefits of information technologies (IT). The analysis and results presented in this book will allow a higher degree of confidence and certainty in decisions concerning the use of IT in efforts to reduce climate change and other environmental effects. Coverage includes

CMOS

CMOS
  • Author : R. Jacob Baker
  • Publisher : John Wiley & Sons
  • Release Date : 2008
  • ISBN : 9780470229415
DOWNLOAD BOOKCMOS

Praise for CMOS: Circuit Design, Layout, and SimulationRevised Second Edition from the Technical Reviewers "A refreshing industrial flavor. Design concepts are presented as they are needed for 'just-in-time' learning. Simulating and designing circuits using SPICE is emphasized with literally hundreds of examples. Very few textbooks contain as much detail as this one. Highly recommended!" --Paul M. Furth, New Mexico State University "This book builds a solid knowledge of CMOS circuit design from the ground up. With coverage of process integration,