Modeling Analysis Design and Tests for Electronics Packaging beyond Moore

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Download or read online Modeling Analysis Design and Tests for Electronics Packaging beyond Moore PDF book by Hengyun Zhang in ePUB, PDF or Kindle eBooks. Published by Woodhead Publishing in 22 November 2019 the book become immediate popular and critical acclaim in Technology & Engineering books with total hardcover page 434. Click Download Book button to get book file. Read some info about this book below.

  • Author : Hengyun Zhang
  • Publisher : Woodhead Publishing
  • Release : 22 November 2019
  • ISBN : 9780081025338
  • Page : 434 pages
  • Language : English
  • Total View : 6296 Views
  • File Size : 43,6 Mb

Modeling Analysis Design and Tests for Electronics Packaging beyond Moore Book PDF summary

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging

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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
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DOWNLOAD BOOKModeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore PDF book is popular Technology & Engineering book written by Hengyun Zhang,Faxing Che,Tingyu Lin,Wensheng Zhao. The book was released by Woodhead Publishing in 22 November 2019 with total hardcover pages 434. Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore
  • Total View : 671
  • File Size : 43,9 Mb
DOWNLOAD BOOKModeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore PDF book is popular Technology & Engineering book written by Hengyun Zhang,Faxing Che,Tingyu Lin,Wensheng Zhao. The book was released by Woodhead Publishing in 15 September 2019 with total hardcover pages 434. Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important

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