Chemical Mechanical Planarization of Microelectronic Materials

Book Chemical Mechanical Planarization of Microelectronic Materials Cover

Chemical Mechanical Planarization of Microelectronic Materials PDF book by Joseph M. Steigerwald Read Online or Free Download in ePUB, PDF or Kindle eBooks. Published in 26 September 2008 the book become immediate popular and critical acclaim in Science books. Click Download Book button to get book file. Read some info about this book below.

  • Publisher : John Wiley & Sons
  • Release : 26 September 2008
  • ISBN : 9783527617753
  • Page : 337 pages
  • Total View : 3802 Views
  • Rating : 4.5/5 from 103 voters

Chemical Mechanical Planarization of Microelectronic Materials Book PDF summary

Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.

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Chemical Mechanical Planarization of Microelectronic Materials

Chemical Mechanical Planarization of Microelectronic Materials
  • Author : Joseph M. Steigerwald,Shyam P. Murarka,Ronald J. Gutmann
  • Publisher : John Wiley & Sons
  • Total Download : 727
  • File Size : 49,9 Mb
DOWNLOAD BOOKChemical Mechanical Planarization of Microelectronic Materials

Chemical Mechanical Planarization of Microelectronic Materials PDF book is popular Science book written by Joseph M. Steigerwald,Shyam P. Murarka,Ronald J. Gutmann. The book was released by John Wiley & Sons in 26 September 2008 with total hardcover pages 337. Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of

Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization
  • Author : Yuzhuo Li
  • Publisher : John Wiley & Sons
  • Total Download : 664
  • File Size : 46,6 Mb
DOWNLOAD BOOKMicroelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization PDF book is popular Science book written by Yuzhuo Li. The book was released by John Wiley & Sons in 19 October 2007 with total hardcover pages 337. An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals

Advances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP)
  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing
  • Total Download : 618
  • File Size : 55,9 Mb
DOWNLOAD BOOKAdvances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP) PDF book is popular Science book written by Suryadevara Babu. The book was released by Woodhead Publishing in 24 September 2021 with total hardcover pages 337. Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric

Chemical-Mechanical Planarization of Semiconductor Materials

Chemical-Mechanical Planarization of Semiconductor Materials
  • Author : M.R. Oliver
  • Publisher : Springer Science & Business Media
  • Total Download : 355
  • File Size : 46,9 Mb
DOWNLOAD BOOKChemical-Mechanical Planarization of Semiconductor Materials

Chemical-Mechanical Planarization of Semiconductor Materials PDF book is popular Science book written by M.R. Oliver. The book was released by Springer Science & Business Media in 26 January 2004 with total hardcover pages 337. This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization
  • Author : Yuzhuo Li
  • Publisher : John Wiley & Sons
  • Total Download : 246
  • File Size : 41,5 Mb
DOWNLOAD BOOKMicroelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization PDF book is popular Science book written by Yuzhuo Li. The book was released by John Wiley & Sons in 02 October 2022 with total hardcover pages 337. An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals

Nanoparticle Engineering for Chemical-Mechanical Planarization (Open Access)

Nanoparticle Engineering for Chemical-Mechanical Planarization (Open Access)
  • Author : Ungyu Paik,Jea-Gun Park
  • Publisher : CRC Press
  • Total Download : 907
  • File Size : 52,5 Mb
DOWNLOAD BOOKNanoparticle Engineering for Chemical-Mechanical Planarization (Open Access)

Nanoparticle Engineering for Chemical-Mechanical Planarization (Open Access) PDF book is popular Science book written by Ungyu Paik,Jea-Gun Park. The book was released by CRC Press in 20 June 2019 with total hardcover pages 337. In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to

Chemical Mechanical Planarization IV

Chemical Mechanical Planarization IV
  • Author : R. L. Opila
  • Publisher : The Electrochemical Society
  • Total Download : 522
  • File Size : 41,8 Mb
DOWNLOAD BOOKChemical Mechanical Planarization IV

Chemical Mechanical Planarization IV PDF book is popular Science book written by R. L. Opila. The book was released by The Electrochemical Society in 02 October 2022 with total hardcover pages 337.

Chemical-Mechanical Planarization of Semiconductor Materials

Chemical-Mechanical Planarization of Semiconductor Materials
  • Author : M.R. Oliver
  • Publisher : Springer Science & Business Media
  • Total Download : 158
  • File Size : 54,6 Mb
DOWNLOAD BOOKChemical-Mechanical Planarization of Semiconductor Materials

Chemical-Mechanical Planarization of Semiconductor Materials PDF book is popular Science book written by M.R. Oliver. The book was released by Springer Science & Business Media in 14 March 2013 with total hardcover pages 337. This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.